Mechanical Simulation Engineer – Advanced Packaging
HyderabadFull-time2–5 yrsPosted 3 months ago
Mid-level mechanical and production role at Micron Technology in Hyderabad. Needs 2+ years.
About the role
As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding.
What you'll do
- Perform linear and non-linear static analysis for package and material behavior
- Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages
- Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic)
- Integrate Generative AI, AI Assistant tools, and Artificial Intelligence for simulation acceleration and optimization
- Apply AI/ML techniques for surrogate modeling, reduced-order modeling, and design optimization
What you need
- LLMs
- Fabrication
- Machine learning