Server Structural FEA Engineer
RemoteFull-time10–18 yrsPosted 1 week ago
Leadership mechanical and production role at Qualcomm. Needs 10+ years and a B.Tech, B.E. or M.Tech. Remote.
About the role
We are seeking a Staff / Senior Staff Server Structural FEA Engineer with deep expertise in semiconductor package mechanics, structural reliability, and advanced finite element analysis. The role focuses on structural integrity and reliability of server SoCs, spanning die- and package-level behavior through interaction with the server platform.
What you'll do
- Develop and apply advanced structural and thermo-mechanical FEA methodologies for server SoCs and advanced semiconductor packages, including CPI, package assembly
- Evaluate both soldered and socketed packages under package assembly, SMT, socket and retention loading, cooling-system loading, temperature cycling, qualification
- Analyze package-to-platform mechanical interaction among the SoC package, PCB, socket or retention system, heatsink or cold plate, and thermal interface materials
- Apply advanced FEA techniques including submodeling, contact analysis, material and geometric nonlinearity, viscoelasticity, creep, fatigue
- Develop physics-based reliability and life-prediction models for relevant failure mechanisms, including solder and bump fatigue, die and BEOL stress
What you need
- ANSYS
- Mechanical engineering
- Physics
- Structural design