Sr. Packaging Engineer (Semiconductor)
HyderabadFull-time5–9 yrsPosted 2 weeks ago
Senior electrical and electronics role at Semtech_Advanced_Systems_India_Private_Ltd_v2 in Hyderabad. Needs 5+ years and a PhD, B.Tech or B.E..
About the role
Sr. Packaging Engineer (Semiconductor) at Semtech_Advanced_Systems_India_Private_Ltd_v2. Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS.
What you'll do
- Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS
- Failure Analysis & Yield Support: Perform systematic failure analysis of package-related defects — including die cracking, chipping, delamination, wire bond lift
- Cross-Functional Collaboration: Partner closely with IC design, process engineering, product engineering
- Package Simulation & Characterization: Conduct package-level electrical and thermal simulations to optimize package performance for high-current transient protection…
What you need
- SPC
- Test cases
- Physics
- TDS