Group Leader – Die Prep & Dicing
BhubaneswarFull-time10–18 yrsPosted 1 week ago
Leadership mechanical and production role at 3D Glass Solutions, Inc- in Bhubaneswar. Needs 10+ years and a B.Tech or B.E..
About the role
The Group Leader – Die Prep & Dicing is responsible for leading development, optimization, qualification, and manufacturing support activities for wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice die inspection processes used in advanced semiconductor assembly.
What you'll do
- Lead development, optimization, and qualification of wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing
- Build and develop the die preparation team, including onboarding of entry level engineers and technicians, structured on-the-job training
- Mentor and coach entry level process engineers and technicians on die preparation fundamentals, recipe structure, data-driven troubleshooting
- Define and control critical process parameters including target die thickness, total thickness variation, grinding wheel selection and grit sequence, spindle load
- Own and improve die preparation process performance with focus on thickness uniformity, die strength, kerf placement accuracy, chipping control, and process robustness
What you need
- Mechanical engineering
- SPC
- FMEA
- Troubleshooting
- Maintenance
- Root cause analysis
Good to have
- Preventive maintenance
- Financial modelling
- SOP writing