Group Leader – Wire Bond & Mold
BhubaneswarFull-time10–18 yrsPosted 1 week ago
Leadership mechanical and production role at 3D Glass Solutions, Inc- in Bhubaneswar. Needs 10+ years and a B.Tech or B.E..
About the role
The Group Leader – Wire Bond & Mold is responsible for leading development, optimization, qualification, and manufacturing support activities for plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash, and laser marking processes used in advanced semiconductor assembly.
What you'll do
- Lead development, optimization, and qualification of plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash
- Build and develop the wire bond and mold team, including onboarding of entry level engineers and technicians, structured on-the-job training
- Mentor and coach entry level process engineers and technicians on wire bond and mold fundamentals, recipe structure, data-driven troubleshooting
- Define and control critical process parameters including EFO current and time, free air ball formation, bond force, ultrasonic power and time
- Own and improve wire bond and molding process performance with focus on bond strength consistency, loop and wire sweep control, mold fill and void control
What you need
- Mechanical engineering
- SPC
- FMEA
- Troubleshooting
- Chemistry
- Root cause analysis
Good to have
- Preventive maintenance
- SOP writing