Packaging Lead FOL

About the role

Packaging Lead FOL at Tata Electronics. We are seeking an experienced Front‑of‑Line (FOL) Lead to own and optimize IC assembly/process steps up to EOL handoff in a high‑volume OSAT environment.

What you'll do

• Own end‑to‑end FOL process flows for assigned packages (e.g., QFN/QFP, BGA/FCBGA, WLCSP, SIP/POP )
• Own cost of manufacturing (COM) levers: materials usage (epoxy, underfill, mold compound), rework, tool life, consumables, and setup optimization
• Create package build plans , control plans , and risk assessments (PFMEA) for new products/packages
• Lead engineering builds , pilot runs , correlation plans , and ramp‑to‑HVM with stable yields and CPK
• Customer-facing quality ownership, including escalation handling and audit leadership

What you need

• 6–10 years in mechanical & production
• FMEA
• APQP
• PPAP
• SPC
• Root cause analysis
• IATF 16949
• B.Tech or B.E.