Program Manager

About the role

This role is responsible for developing cutting-edge, cost-effective packaging solutions for integrated circuits, ensuring optimal performance, reliability, and manufacturability. Fully accountable for new product development – design > material selection > qualification > LVM > Offload and process engineer providing end to end technology & process development, covering conventional & advanced packages.

What you'll do

• Must be very familiar and hands-on experience on the TD / NPI methodology, covering all the process involved
• Provide direction, technical leadership and hands-on experience to ensure all different functional dept work in sync to achieve the common dept/org goal
• Lead, understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution
• Make a characterization plan and risk assessment for new and existing device requiring engineering support
• Drive yield and quality improvement

What you need

• 15–27 years in consulting & strategy
• APQP
• FMEA
• SPC
• SOP writing
• TPM
• Problem solving
• B.Tech or B.E.