Silicon Package Design Engineer

About the role

In this role, you will perform substrate fit and routing studies to optimize performance, cost, and manufacturability while collaborating with customers and internal teams. Your contributions will directly impact the creation of Intel's advanced silicon packaging solutions, ensuring they meet electrical and manufacturing requirements.

What you'll do

• Collaborate with customers and electrical engineers to optimize signal integrity and power delivery
• Create bump patterns and placements while adhering to design rule requirements
• Perform signal routing planning and power grid placement to meet electrical and manufacturing standards
• Conduct various layout verification processes, including routing checks, connectivity validation, DRC (Design Rule Check), and electromigration analysis
• Provide feedback on feasibility studies and implement customer enhancement requests

What you need

• 1–6 years in electrical & electronics
• PCB design
• Python
• Perl
• Linux
• B.Tech or B.E.