Staff Package Design Engineer

About the role

We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

What you'll do

• Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules
• Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM)
• Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures
• Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews

What you need

• 6–11 years in electrical & electronics
• Any graduate