3D-IC Methodology Architect

About the role

BANGALORE, Karnataka, India; Dresden, Saxony, Germany; Sofia, Bulgaria; Singapore, Singapore; Malta, New York, United States of America

What you'll do

• The 3D-IC Methodology Architect will define and lead an integrated methodology that helps customers and internal product teams move from system architecture and chiplet…
• The role combines hands-on technical depth with cross-functional leadership across design enablement, PDK and IP teams, packaging, product lines, manufacturing
• Reusable system-level reference examples, beginning with digital-on-digital and digital-on-memory and expanding to digital-on-IVR, RF plus digital
• Package and system co-design methods for package trade studies, die-to-die planning and system-technology co-optimization
• Production-ready multi-die physical implementation flows covering floorplanning, interposer and RDL implementation, assembly definition and verification

What you need

• 15–27 yrs of experience
• Linux
• Physics
• ANSYS
• B.Tech or B.E. or PhD

Good to have

• Python
• Java
• LLMs
• Perl