Engineer- Multi-Physics Sign-off (Timing, PDN & Thermal)

About the role

We are seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust, scalable, and production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analysis, in close collaboration with physical design, package, PI, reliability, and EDA vendor teams.

What you'll do

• This is a hand-on role for delivering tool-flow-methodology and automation
• 3DIC / 2.5D CAD Flow Development
• Develop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologies
• Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout
• Support die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint management

What you need

• 5–9 yrs of experience
• Physics
• VLSI
• ANSYS
• Any graduate