Principal Packaging Engineer

About the role

We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura’s next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products.

What you'll do

• Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability
• Drive package technology selection, including flip-chip, advanced substrates, fan-out, and future multi-die integration approaches
• Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors
• Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O
• Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification

What you need

• System design
• Any graduate