Senior IC Substrate Package Layout Designer

About the role

Senior IC Substrate Package Layout Designer at MaxLinear. We are looking for an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis.

What you'll do

• The role requires close collaboration with Backend/Physical Design, SI/PI, Assembly, Reliability
• Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff
• Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost
• Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages
• Collaborate closely with Backend, SI/PI, Thermal, Assembly, OSAT, and substrate vendors to resolve design and manufacturing challenges

What you need

• 4–7 yrs of experience
• VLSI
• B.Tech or B.E.

Good to have

• Python
• Perl