- Can I apply
- Needs M.Sc or B.Tech or B.E. · 3–6 yrs
- Pay
- Pay not stated
- Source
- From the company's careers page · today
- How to apply
- On HPE's site: account needed, ~10–15 min
Early: posted 1 h ago on their own site
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About the role
IC Package Design Engineer with 8+ years experienced Already done 4 to 5 tape outs. Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies.
What you'll do
- Design and architect large-scale solutions, ensuring scalability, performance, and security
- Train and develop team so as to ensure that there is an adequate supply of trained manpower in the said technology and delivery risks are mitigated
- Continuously upskill with cutting-edge tech to deliver high-quality, future-proof solutions meeting client expectations and industry standards
- Leverage domain/tech expertise to gather client needs, deliver solutions, and craft a technology strategy aligned with business goals
What you need
- 8–14 yrs of experience
- Any graduate
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