Sr. Packaging Engineer (Semiconductor)

Semtech_Advanced_Systems_India_Private_Ltd_v2·Hyderabad

Pay not stated5–9 yrsFull-time

Apply on Semtech_Advanced_Systems_India_Private_Ltd_v2's site Track your applications and see your fit: start free

Read from the company's own careers page; you apply on their site.

How well do you fit this job?

Upload your resume to see each requirement checked against your profile, in under a minute.

Check my fit

Hard to read?

About the role

Sr. Packaging Engineer (Semiconductor) at Semtech_Advanced_Systems_India_Private_Ltd_v2. Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS.

What you'll do

Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS
Failure Analysis & Yield Support: Perform systematic failure analysis of package-related defects — including die cracking, chipping, delamination, wire bond lift
Cross-Functional Collaboration: Partner closely with IC design, process engineering, product engineering
Package Simulation & Characterization: Conduct package-level electrical and thermal simulations to optimize package performance for high-current transient protection…