Solution Director

About the role

The ideal candidate will have strong expertise in high-speed interface design, package and substrate design, electromagnetic simulation, power delivery network optimization and advanced packaging technologies.

What you'll do

• Lead Signal Integrity (SI) and Power Integrity (PI) analysis for advanced semiconductor packages and high-speed interconnects
• Drive package and substrate design optimization for high-performance computing, networking, AI/accelerator and SoC products
• Perform pre-layout and post-layout SI/PI analysis, including crosstalk, insertion loss, return loss, impedance matching and power delivery network (PDN) analysis
• Lead package-level and package-to-board co-design activities, including bump maps, escape routing, substrate stack-up and interconnect optimization
• Perform electromagnetic (EM) simulations and analyze high-speed interfaces such as PCIe, DDR, HBM, SerDes, Ethernet and other high-bandwidth interfaces

What you need

• 15–27 yrs of experience
• ANSYS
• Root cause analysis
• Power systems
• Any graduate