Group Leader – Die Attach & Underfill

About the role

The Group Leader – Die Attach & Underfill is responsible for leading development, optimization, qualification, and manufacturing support activities for flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes used in advanced semiconductor assembly.

What you'll do

• Lead development, optimization, and qualification of flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill
• Build and develop the die attach and underfill team, including onboarding of entry level engineers and technicians, structured on-the-job training
• Mentor and coach entry level process engineers and technicians on die attach and underfill fundamentals, recipe structure, data-driven troubleshooting
• Define and control critical process parameters including bond force, bond temperature and dwell time, placement accuracy in X, Y, and theta
• Own and improve die attach and underfill process performance with focus on interconnect integrity, placement accuracy, bond line thickness control

What you need

• 10–18 yrs of experience
• Mechanical engineering
• SPC
• FMEA
• Troubleshooting
• Root cause analysis
• Preventive maintenance
• B.Tech or B.E.

Good to have

• SOP writing