Group Leader – SMT

About the role

The Group Leader – SMT is responsible for leading development, optimization, qualification, and manufacturing support activities for solder paste printing, solder paste inspection, component placement, reflow soldering, post-reflow cleaning, and automated optical inspection processes on PCB strip format used in advanced semiconductor assembly.

What you'll do

• Lead development, optimization, and qualification of solder paste printing, solder paste inspection, component placement, reflow soldering, cleaning
• Build and develop the SMT team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices
• Mentor and coach entry level process engineers and technicians on SMT fundamentals, recipe structure, data-driven troubleshooting, and safe equipment handling
• Define and control critical process parameters including stencil aperture geometry and area ratio, foil thickness and material, squeegee pressure and speed
• Own and improve SMT process performance with focus on print transfer efficiency, placement accuracy, solder joint quality, voiding control, assembly cleanliness

What you need

• 10–18 yrs of experience
• Mechanical engineering
• SPC
• FMEA
• Troubleshooting
• Chemistry
• Root cause analysis
• B.Tech or B.E.

Good to have

• Preventive maintenance
• SOP writing