Group Leader – End of Line

About the role

The Group Leader – End of Line is responsible for leading development, optimization, qualification, and manufacturing support activities for ball attach in strip and singulated unit formats, reflow, cleaning, thermal interface material dispensing and lid attach, strip saw singulation, laser marking, automated visual and X-ray inspection, and bake and dry pack processes used in advanced semiconductor assembly.

What you'll do

• Lead development, optimization, and qualification of ball attach in strip and singulated unit formats, reflow, cleaning
• Build and develop the end of line team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices
• Mentor and coach entry level process engineers and technicians on end of line fundamentals, recipe structure, data-driven troubleshooting, and safe equipment handling
• Define and control critical process parameters including flux print thickness and dip depth, ball placement accuracy, reflow profile and nitrogen concentration
• Own and improve end of line process performance with focus on solder ball integrity, ball coplanarity, lid bond line and void control, singulation edge quality

What you need

• 10–18 yrs of experience
• Mechanical engineering
• SPC
• FMEA
• Troubleshooting
• Quality control
• Root cause analysis
• B.Tech or B.E.

Good to have

• Preventive maintenance
• SOP writing