Group Leader – Wire Bond & Mold

About the role

The Group Leader – Wire Bond & Mold is responsible for leading development, optimization, qualification, and manufacturing support activities for plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash, and laser marking processes used in advanced semiconductor assembly.

What you'll do

• Lead development, optimization, and qualification of plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash
• Build and develop the wire bond and mold team, including onboarding of entry level engineers and technicians, structured on-the-job training
• Mentor and coach entry level process engineers and technicians on wire bond and mold fundamentals, recipe structure, data-driven troubleshooting
• Define and control critical process parameters including EFO current and time, free air ball formation, bond force, ultrasonic power and time
• Own and improve wire bond and molding process performance with focus on bond strength consistency, loop and wire sweep control, mold fill and void control

What you need

• 10–18 yrs of experience
• Mechanical engineering
• SPC
• FMEA
• Troubleshooting
• Chemistry
• Root cause analysis
• B.Tech or B.E.

Good to have

• Preventive maintenance
• SOP writing