Group Leader – Die Prep & Dicing

About the role

The Group Leader – Die Prep & Dicing is responsible for leading development, optimization, qualification, and manufacturing support activities for wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice die inspection processes used in advanced semiconductor assembly.

What you'll do

• Lead development, optimization, and qualification of wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing
• Build and develop the die preparation team, including onboarding of entry level engineers and technicians, structured on-the-job training
• Mentor and coach entry level process engineers and technicians on die preparation fundamentals, recipe structure, data-driven troubleshooting
• Define and control critical process parameters including target die thickness, total thickness variation, grinding wheel selection and grit sequence, spindle load
• Own and improve die preparation process performance with focus on thickness uniformity, die strength, kerf placement accuracy, chipping control, and process robustness

What you need

• 10–18 yrs of experience
• Mechanical engineering
• SPC
• FMEA
• Troubleshooting
• Maintenance
• Root cause analysis
• B.Tech or B.E.

Good to have

• Preventive maintenance
• Financial modelling
• SOP writing